Method for quickly identifying high-flux tissue grinder failures

The maintenance of high-throughput tissue grinders has always been an important factor in maintaining its stability and reducing the rate of failure, but how do we find the problem for instruments that already have faults? Today we are going to teach you several ways to quickly identify high-throughput tissue grinder failures.

   First, the observation method

   Through vision, smell and touch. In some cases, damaged components will change color, blister or burnt spots; burnt devices will produce some special odor; short-circuited chips will be hot; visible or desoldered parts can also be observed with the naked eye. .

  Second, the tapping method

   The so-called tapping is to gently tap the board or component of the high-throughput tissue grinder through a small rubber hammer or other knocker to see if it can cause an error or a downtime. The so-called hand pressure is when the fault occurs, after the power is turned off, the inserted components and the plug and the seat are again pressed by hand, and then the power is turned on to try to eliminate the fault. If you find that the case is normal, and then knocking is not normal, it is best to first re-insert all the connectors and try again. If the brain is unsuccessful, you have to find another way.

  Third, the exclusion method

   A method for judging the cause of a fault by plugging in some boards and devices inside the machine. When the instrument returns to normal after removing a board or device, the fault has occurred there.

  Fourth, the temperature rise and fall method

   Sometimes the high-throughput tissue grinder works for a long time, or when the working environment temperature is high in summer, it will malfunction. The shutdown check is normal, and it will be normal after a period of time, and then it will malfunction after a while. This phenomenon is caused by the poor performance of individual ic or components, and the high temperature characteristic parameters fail to meet the requirements of the index. In order to find out the cause of the malfunction, the temperature rise and fall method can be employed